Best rated electronic parts marketplace information sheets
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When the user equipment communicates with the AP1, because the equipment receives the interference signal of the AP2 with the same frequency, the user equipment will mistakenly think that the cell of the AP1 is being occupied by other devices in the cell at this time, so wait for the next time period to send. As a result, network performance is degraded. Not only multi-cell networking, this kind of interference problem will also occur when the Wi-Fi AP is very close. For example, although you have only one wireless AP in your home, if your next-door neighbor has an AP deployed on the same channel as you, CCI will also reduce the success rate of your device access. Sadly, most manufacturers put Wi-Fi AP’s default channel on the first channel when the device leaves the factory. In this way, the problem of interference is even more serious. If you find this problem, you might as well change the Wi-Fi AP channel at home, which will significantly reduce interference and increase Internet speed. The solution of Wi-Fi 6 is to distinguish the local cell from the interference cell by introducing BSS Coloring (Cell Color coding) technology into the MAC layer. In other words, when working on the same channel, the AP that interferes with each other will be distinguished by different color codes.
From April 2020 to June 2020, the demand for cars dropped sharply due to the spread of the COVID-19 epidemic. Automakers purchase parts according to Toyota’s “Just In Time” mode of operation, so, for example, Toyota canceled orders for in-car semiconductors for Denso, its main subcontractor, which canceled orders for in-car semiconductors such as Renesas, which then cancelled subsequent orders for 28nm, which was commissioned by TSMC. Due to the special needs of COVID-19 at home under the epidemic, the production of 28nm semiconductors such as TSMC game consoles and household appliances swarmed in, and the blank production line after the cancellation of car semiconductors was instantly filled with these semiconductors.
The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.
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