Top ceramic printed circuit board factory
Top ceramic printed circuit board provider: Dust can cause damage in multiple ways. Firstly, it can reduce the heat dissipation of a device. It also contributes to damage by way of static electricity. Storing a PCB in temperatures that are not optimal can certainly lead to damage! Temperatures that are too low lead to condensation that adversely affects the PCB. Similarly, temperatures that are too high lead to warpage. If PCBs are stored in the proximity of chemical reagents, the fumes from the reagents tend to corrode the PCB. Finally, storing PCBs in a place that is infested with pests can lead to biting the PCBs and rendering them unusable. Discover additional information on pcb assembly manufacturer.
Sometimes people will use abbreviation “MCPCB”, instead of the full name as Metal Core PCB, or Metal Core Printed Circuit Board. And also used different word refers the core/base, so you will also see different name of Metal Core PCB, such as Metal PCB, Metal Base PCB, Metal Backed PCB, Metal Clad PCB and Metal Core Board and so on. MCPCBs are used instead of traditional FR4 or CEM3 PCBs because of the ability to efficiently dissipate heat away from the components. This is achieved by using a Thermally Conductive Dielectric Layer.
What is Ultra-Thin HDI PCB? High-Density Interconnect PCB is simply an ultra-thin PCB having more counts of interconnections, covering minimal space, leading to circuit board miniaturization. The components of HDI PCB are positioned closer, reducing the board space significantly but not compromising its performance. HDI is among the fastest advancing PCB technologies, capable of integrating smaller capture pads and vias and higher densities of connection pad. HDI PCBs have buried and blind vias and usually comprise of microvias with diameter of 0.006 or lower. Extra thin HDI PCBs provide better construction, layout and design choices by integrating outstanding features like microvias.
Multilayer printed circuit boards (PCBs) consist of three or more layers of conductive material, usually copper, separated by insulating layers. Small holes filled with conductive material called vias interconnect the layers. Multilayer PCBs offer the same advantages as double-layer PCBs but have even more routing options and the ability to place components on multiple layers. Rigid printed circuit boards (PCBs) are solid sheets of insulating material, typically fiberglass, with copper traces etched into them. The finished boards are very strong and can withstand high temperatures and mechanical stress. Rigid PCBs are for applications where reliability and durability are critical, such as in military and aerospace applications.
Most of our engineer and operators has more than ten years of experience in PCB industry, so we can produce special such as 20 OZ heavy copper board, 4 layers MCPCB, etc. At the same time, we purchased many advanced, art-of-state machines & devices for PCB manufacturing, checking, to improve the quality of our boards.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. See additional info at https://www.bstpcb.com/.
Double sided flex circuits consists with double sided copper conductors and can be connected from both sides. It allows more complicated circuit designs, more components assembled. The major material used are copper foil, polyimide and coverlay. Adhesiveless stack up is popular for better dimensional stability, high temperature, thinner thickness. Dual access flexible circuit board refer to the flex circuit which can be accessed from both top and bottom side but only has only layer of conductor trace. Copper thickness 1OZ and coverlay 1mil, it similar with 1 layer FPC and opposite side FFC. There’re coverlay openings on both sides of flex circuit so that there’re solderable PAD on both top and bottom sides, that is similar with double sided FPC, but dual access flex circuit board has different stack up because of only one copper trace, so no plating process is need to make plated through hole (PTH) to connect between top and bottom side, and trace layout is much more simple. Capability: We are continued to improve our MCPCB, FR4 PCB & FPC & Ceramic PCB manufacturing level to get satisfactory result from customers and ourselves.
Cheaper PCBs and perf boards (shown above) will be made with other materials such as epoxies or phenolics which lack the durability of FR4 but are much less expensive. You will know you are working with this type of PCB when you solder to it – they have a very distictive bad smell. These types of substrates are also typically found in low-end consumer electronics. Phenolics have a low thermal decomposition temperature which causes them to delaminate, smoke and char when the soldering iron is held too long on the board.
Tg means Glass Transition Temperature. As flammability of printed circuit board (PCB) is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of PCB will be affected. If working temperature of your product is higher than normal (130-140C), then have to use High Tg PCB material which is > 170C. and popular PCB high value are 170C, 175C, and 180C. Normally the FR4 circuit board Tg value should be at least 10-20C higher than working temperature of product. If you 130TG board, working temperature will be lower than 110C; if use 170 high TG board, then maximum working temperature should be lower than 150C.